19-03-2024 | Mouser Electronics | Automotive & Transport
Mouser has announced a new interactive content series in collaboration with Molex. ‘The Future of Miniaturization in Technology’ features articles, videos, and an infographic examining the forefront of miniaturisation trends shaping our connected future. The content covers miniaturisations in AR/VR, medical and consumer wearables, mmWave, IoT and automotive applications.
The content series also showcases many key products from Molex that play essential roles in addressing the design challenges of miniaturisation. Featured solutions include the Molex SMP-MAX and SMP-MAX EVO 50-Ohm RF connectors. These microminiature connectors provide push-on and snap coupling options and configurations in surface mount and through-hole mounting options. High-power ratings of up to over 300W at 2.7GHz offer excellent performance for RF amplifiers.
The Molex Quad-Row board-to-board connectors are designed to allow high power in a compact form factor. With these high-density connectors, designers can incorporate more features, sensors, and functionality into evermore tight spaces without compromising device performance. These connectors are excellent for AR/VR devices and other wearables.
The Molex Contrinex inductive sensors are robust, self-contained, and include an integrated IO-link, making them excellent for limited-space applications. These sensors provide a large sensing range and a smart communication system that continuously monitors process data and diagnoses sensor status. Their one-piece factor-1 steel and aluminium housing provides rugged mechanical and chemical protection from extreme conditions. The small form factor of the inductive sensors makes them ideal for integration into machinery, equipment, and even hazardous or hard-to-reach locations, supplying a scalable and flexible solution for modernising industrial processes.
By Seb Springall
